SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

专利名称：SEMICONDUCTOR MODULE AND POWER

CONVERSION DEVICE

发明人：川瀬 達也,中田 洋輔,井本 裕児,碓井 修申请号：JP2018546129申请日：20161021

公开号：JPWO2018073965A1公开日：20190322

摘要：A plurality of semiconductor elements (4a-4f, 5a-5f) are provided on the uppersurface of a conductive base plate (1) via an insulating substrate (2) and conductivepatterns (3a-3d). A plurality of fins (6) are provided on the lower surface of the

conductive base plate (1). A heat dissipating base plate (7) is provided at the leading endsof the fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in thebottom surface surrounds the fins (6) and the heat dissipating base plate (7). A partition(10) partitions the space surrounded by the cooler (8) and the heat dissipating base plate(7) into an inflow-side space (11a) connected to the inflow port (19a), and an outflow-sidespace (11b) connected to the outflow port (9b). A first slit (12a) is provided at a centerportion of the heat dissipating base plate (7), and second and third slits (12b, 12c) arerespectively provided on both the sides of the heat dissipating base plate (7), said sidesbeing in the direction toward the outflow side from the inflow side. The first slit (12a) orboth the second and third slits (12b, 12c) are the inflow-side slits connected to the inflow-side space (11a), and the other is the outflow-side slit connected to the outflow-sidespace (11b).

申请人：三菱電機株式会社

地址：東京都千代田区丸の内二丁目７番３号

国籍：JP

代理人：高田 守,高橋 英樹,久野 淑己

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